MY 3200 Materials Characterization I


Topics to be covered.
  1. Optical Metallography & Quantitative Image Analysis
  2. Mechanical testing
  3. Crystal Geometry
    • Review of crystal systems,
    • lattice vectors,
    • lattice points,
    • planes and directions - Miller Indices,
    • Hexagonal Miller-Bravais Indices {hkil} and conversion to/from Miller Indices {hkl}.
  4. Stereographic Projections
  5. Scanning Electron Microscopy
    • Secondary electron imaging - topography
    • Backscattered electron imaging - composition
  6. X-Ray Diffraction/Electron Diffraction
  7. Spectroscopy
  8. Band gap of a semiconductor
  9. Tensile Testing Experiment
  10. Hardness Experiment
  11. Particle Size Distribution Experiment
  12. Measurement of Grain Size Experiment
  13. Metallography of Steel
  14. Oxidation Experiment
  15. TTT diagrams
  16. Viscosity Experiment
  17. Fracture Experiment
Students must be familiar with using EXCEL and MATHCAD. Attendance in class is not mandatory but there are numerous problem solving sessions in class.