MS&E Students Win Awards & Scholarships!
Danielle Visser has been awarded a TMS Light Metals Division (LMD) scholarship for the 2002-2003 academic year. The award consists of a $4,000 scholarship, $400 of LMD sponsored books for her personal use, and $300 of LMD sponsored books for the Van Pelt Library. It also includes a travel allowance to attend the upcoming 132nd TMS Annual Meeting in San Diego, where she will be honored at an awards luncheon.
2002 ASM International Foundation Undergraduate Scholarship Recipients:
These scholarships were established in 1995 through a generous contribution from Dr. George A. Roberts, Past President of ASM and Retired CEO of Teledyne, to the ASM Foundation as an expression of his commitment to education and the materials science and engineering community. The scholarships are awarded to outstanding undergraduate members of ASM at the junior or senior level who demonstrate exemplary academic and personal achievements, interest and potential in metallurgy or materials science and engineering. Ten scholars are selected each year, are presented with a certificate, and check for $6,000 towards educational expenses for one academic year. For more information, please see ASM International's 2002 Undergraduate Scholarship Recipients Web Site ASM International Foundation Scholarship
TMS Student Design Competition award “The Materials Science and Engineering Undergraduate Student Design Competition annually honors the premier design project submitted by a [North American or international] university. Entries may be submitted from departments of materials science and engineering, metallurgy, metallurgical engineering, ceramic engineering, and polymer engineering, or from related departments or programs (including but not limited to mechanical engineering, chemical engineering, electrical engineering, physics, or chemistry).”
Team members were: The Faculty Advisor was Doug Swenson. The Industrial Partners were Don Henderson (IBM Endicott) and Karl Puttlitz (IBM Fishkill). The team will receive a cash award of $1000 and $500 toward travel expenses to attend the TMS 132nd Annual Meeting in San Diego on March 4, 2003, where the award will be presented. Michigan Tech’s winning entry, “Intermetallic Growth in Lead Free Solders”, focused on explaining and eliminating the growth of large, plate-like intermetallic particles that appear in silver-tin-copper solders under certain solidification conditions. |